Gigabyte reveals entry-level board with dual-UEFI BIOS

Gigabyte reveals the GA-H61MA-D3V rev 2.0, the company's first entry-level $50 board with dual-UEFI BIOS. Full details at TPU, the motherboard will start shipping in May.

In Japan, the company released the latest revision of the GA-H61MA-D3V (rev. 2.0), an entry-level socket LGA1155 motherboard based on the Intel H61 chipset, which features Dual-UEFI. Apart from this, the board also features GIGABYTE's Ultra-Durable 4 Classic component loadout, which consists of a new fiberglass fabric weave PCB that's more resistant to humidity that causes short-circuits, high ESD-resistance ICs, anti-surge ICs located on critical circuits, low RDS (on) MOSFETs, and a 100% high-grade solid-state capacitor design.

The CPU is powered by a 5-phase VRM, it is wired to two DDR3 DIMM slots supporting up to 16 GB of dual-channel DDR3 memory. Expansion slots include one PCI-Express 3.0 x16, and three PCIe x1. The move to exclude legacy PCI is not only progressive, but could also save GIGABYTE the cost of placing a PCI-PCIe bridge chip. Storage connectivity includes two SATA 6 Gb/s ports from Marvell 88SE9172 (since H61 PCH lacks SATA 6 Gb/s), and four SATA 3 Gb/s ports from the PCH. Other connectivity includes 6-channel HD audio (driven by Realtek ALC887), two USB 3.0 ports (driven by EtronTech EJ168), gigabit Ethernet (driven by Realtek 8111E), and a number of USB 2.0 ports. Display connectivity includes DVI and D-Sub

Gigabyte reveals entry-level board with dual-UEFI BIOS - More news at DV Hardware

Cooler Master reveals Vertical Vapor Chamber CPU cooling technology

Cooler Master send out a press release to detail the new Vertical Vapor Chamber technology used by its new TPC 812 processor cooler. Retail availability is expected by CeBIT 2012.

After releasing the world�s first heatpipe heatsink in 2000, Cooler Master announces that it will begin to phase in Vertical Vapor Chamber technology into its upcoming retail CPU heatsinks; a technology initially developed by Cooler Master�s OEM and industrial cooling division.

Vertical Vapor Chambers feature less than half the air resistance by reducing airflow vortexes and noise generated by air streaming through a heatsink. At the same time vertical vapor chambers exhibit 3 times the fin contact area, enabling faster and more efficient transfer of heat from the vapor chambers to the fins, and overall more efficient use of the available fin surface area.

As a result, Vertical Vapor Chambers allow Cooler Master to develop cooling solutions with greatly reduced noise footprints or increased cooling performance in excess of 200W at the same or lower noise level as without vertical vapor chambers.

The high-end tower heatsink Cooler Master TPC-812, the first product based on this latest technology and Cooler Masters leading product development process will be officially released to the market in a few weeks during CeBIT 2012.

Cooler Master reveals Vertical Vapor Chamber CPU cooling technology - More news at DV Hardware

Microsoft reveals details of ReFS file system

Microsoft has revealed details about ReFS (Resilient File System), a new file system that will be introduced with Windows Server 8. You can learn about it at ZD Net.

ReFS will begin life as a storage system for Windows Server only. Then � some time post Windows 8 � it will become a storage system for Windows clients, and then ultimately �as a boot volume,� said author of the post, Surendra Verma, a development manager on the Windows Storage and File System team. (Interestingly, when the first leaks about ReFS, codenamed Protogon, occurred last year, those who discovered the new file system found it in leaked Windows 8 client builds.)

NTFS, the New Technology File System, has been part of Windows since Windows XP and Windows NT 3.1 were introduced in 2001 and 1993, respectively. (Thanks for the date corrections, readers.)

There are some NTFS features for which Microsoft plans to drop support with ReFS, specifically named streams, object IDs, short names, compression, file level encryption (EFS), user data transactions, sparse, hard-links, extended attributes, and quotas, Verma blogged. That said, one of Microsoft�s goals with ReFS is to �maintain a high degree of compatibility with a subset of NTFS features that are widely adopted while deprecating others that provide limited value at the cost of system complexity and footprint,� Verma said.

Microsoft reveals details of ReFS file system - More news at DV Hardware

AMD reveals Piledriver details to developers

X-bit Labs noticed AMD has released a document that describes Piledriver architecture details to software developers:

Advanced Micro Devices has released a document that is supposed to assist software developers to optimize their programs for AMD�s microprocessors based on Bulldozer micro-architecture and forthcoming chips. Among other things, AMD describes peculiarities of Piledriver micro-architecture as well as chips on its base, including Trinity, Vishera, Terramar and Sepang. The document also mentions Steamroller and Excavator micro-architectures

AMD has a rather strong and clear roadmap for the period of the following three years with the aim to increase performance-per-watt of its high-performance cores by approximately 10% - 15% every year. In practice, this transforms into 33% - 52% speed boost of Excavator micro-architecture compared to Bulldozer. Technologically, AMD wants to improve IPC (instructions per clock) performance and reduce power consumption at the same time, which transforms into higher clock-speeds.

AMD reveals Piledriver details to developers - More news at DV Hardware

SilverStone reveals two new HTPC cases

SilverStone presented two new full-sized HTPC enclosures at CES 2012, you can check them out at The Tech Report.

Silverstone says it hasn't done a major redesign for its HTPC line since 2005, so the Grandia GD07 and GD08 are a long time coming. The two cases are actually quite similar, differing only in the configuration of their drive bays and front panels. The GD07's front face is hidden behind a locking aluminum door, while the GD08 offers a clean front face with spring-loaded doors for just the optical bays. Both cases feature front-panel USB 3.0 connectivity and little sliders that adjust the brightness of the LEDs.

SilverStone reveals two new HTPC cases - More news at DV Hardware

EVGA reveals SR-X dual-socket Sandy Bridge-E board

The Tech Report spotted EVGA's SR-X at CES 2012, you can check it out over here.This enthusiast board takes two Sandy Bridge-E Xeon processors.

The new SR-X retains the dual-Xeon design of its forebear but swaps that board's LGA1366 sockets for compatibility with Intel's 2011-pin Sandy Bridge-E silicon. Alas, you won't be able to plug a couple of desktop-oriented CPUs like the Core i7-3960X into the SR-X; it's designed for Xeons exclusively. Just two Sandy Bridge-E based Xeons offer plenty of PCI Express 3.0 connectivity, allowing the SR-X to serve its seven expansion slots without tapping the PCIe lanes built into the chipset. EVGA does use a PLX switch chip to split the PCIe 3.0 lanes between the multiple slots, though.

On the chipset front, the board features an "Intel C600" platform hub that looks an awful like what the X79 should have been. See that pair of SAS connectors in the bottom right-hand corner of the board? It seems Intel has resolved the storage-controller issues that left the X79 with no more SATA ports than a run-of-the-mill desktop chipset.

EVGA reveals SR-X dual-socket Sandy Bridge-E board - More news at DV Hardware

Zotac also reveals Mini-ITX Z77 motherboard

Zotac also showed off a new Intel Z77 based Mini-ITX motherboard that is aimed at small form factor overclockers. This LGA1155 board draws power from 24-pin ATX and 8-pin EPS connectors, it comes with 8-phase VRM, with a feature-rich controller, Pulse-made inductors, driverMOSFETs (DrMOS), and High-C capacitors. Ivy Bridge is supported out of the box, and the LGA1155 socket is powder-coated to prevent shrinking when subjected to subzero cooling.

The CPU is wired to two DDR3 DIMM slots supporting dual-channel DDR3 memory. The lone expansion slot is a PCI-Express 3.0 x16. Storage connectivity includes two SATA 6 Gb/s, two SATA 3 Gb/s, and an mSATA slot (likely 3 Gb/s). Display connectivity only includes DVI and HDMI. General connectivity includes 8-channel HD audio, gigabit Ethernet, wireless b/g/n, and USB 3.0. This board will have a feature-rich UEFI BIOS.

Source: TPU

Zotac also reveals Mini-ITX Z77 motherboard - More news at DV Hardware

Spire reveals three Kepler CPU coolers

Spire introduced Kepler, a new series of budget processor heatsinks. The basic Kepler cooler offers two direct-touch heatpipes and a heatsink with 45 aluminium fins. The Kepler II has three direct-touch heatpipes and 45 aluminum fins and the Kepler Pro edition offers four direct-touch heatpipes and 50 aluminium fins. All three models use a 92mm fan and come S420 thermal compound. Intel's Socket 775/1155/1156/1366 and AMD's Socket AM2/AM3 platforms are all supported.

The Spire all new Kepler universal micro-processor cooler series are direct contact heat-pipe solutions for Core i3/i5 and i7 from Intel and the AMD AM2/3/FM1 micro-processors. There are three (3) different models ranging from two up to four 6mm sinter powder heat-pipes which are in direct contact with the cpu heat-source, dissipating heat effectively and fast.

The high density fins are crowned with a powerful fan for high airflow and great cooling performance. The 92mm dc fan provides ample airflow and silent cooling at 19.0dBA. Compatibility is ensured with the multi-platform mounting clip for Intel 775/1155/1556 sockets and AM2/AM3/FM1 micro-processors. The Kepler series from Spire are build to deliver great cooling for maximum system performance.

MSRP:
Kepler USD 19.95 / EURO 14.99
Kepler II USD 25.95 / EURO 18.99
Kepler Pro USD 38.95 / EURO 27.99

Availability:
Late October

Spire reveals three Kepler CPU coolers - More news at DV Hardware

Corsair reveals $59 watercooler with aluminium base

Corsair reveals the Hydro H40, a new entry-level watercooling solution that will be sold for $59. The waterblock is made entirely out of aluminium and the radiator comes with a 2000RPM 120mm fan. The system is self-contained and comes with pre-applied thermal compound to speed up installation.

Compatibility is ensured with Intel's LGA775/1155/1156/1366 and AMD's Socket AM2/AM3/FM1 platforms. Corsair describes the H40 as a budget solution for those who want simple and reliable cooling for a gaming rig, without breaking overclocking records.

The Hydro Series H40 is Corsair's new entry-level liquid CPU cooler and is designed to provide effective and reliable liquid cooling at a price that's affordable for mainstream computer users. Like all Corsair Hydro Series liquid CPU coolers, the H40 is a self contained, closed-loop system that comes pre-filled and never needs refilling. It works with most modern AMD and Intel sockets, and comes with an illustrated quick start guide to make installation easy even for CPU cooling novices.

Corsair reveals $59 watercooler with aluminium base - More news at DV Hardware

Fusion-io reveals the ioDrive2 and ioDrive2 Duo

Fusion-io reveals the ioDrive2 and ioDrive2 Duo, a new series of high-end storage solutions for application acceleration and data center optimization. The fastest model is the 1.2TB ioDrive2 Duo, it offers SLC NAND flash memory with a max read speed of 3GB/s, max write speed of 2.6GB/s, read IOPS of 702,000 and write IOPS of 937,000. The ioDrive2 Duo also offers a 2.4TB MLC model, while the regular ioDrive2 series offers 400GB and 600GB units with SLC flash and 365GB, 785GB and 1.2TB editions with MLC. Pricing starts at $5,950.

Fusion-io, Inc., (NYSE: FIO) pioneer of shared data decentralization, today announced the next evolution of its ioMemory platform for powering application acceleration and data center optimization. The company that broke performance barriers, brought you the first enterprise MLC products, dramatically enhanced reliability metrics for enterprise flash, and redefined server side flashhas done it all over again with the new ioDrive2 and ioDrive2 Duo.

�Customers have grown to expect nothing but groundbreaking products from Fusion-io. Today, we are proud to raise the bar once more with the ioDrive2,� said David Flynn, Fusion-io CEO and Chairman. �Just as many competitors gauge success by Fusion-io performance standards, we developed the ioDrive2 to outperform the original ioDrive on all measures. Companies around the world trust ioMemory to supply critical data to their trading platforms, ERP systems, virtual environments, enterprise applications and databases, and now, they can rely on the ioDrive2 to accelerate even more of the data that powers our information economy.�

Continuing Fusion�s history of leadership in storage memory innovation, the new ioDrive2 and ioDrive2 Duo deliver powerful low latency performance, improved endurance and the reliability required by today�s enterprise applications, databases and virtual environments. New features of the ioDrive2 and ioDrive2 Duo include:

Nearly symmetrical read and write access with best in class low queue depth performance

Consistent low latency access for mixed workloads with 15 microsecond write latency, 3 GB/s bandwidth, over 700,000 read IOPS and over 900,000 write IOPS

Maximum capacity in the smallest footprint, with up to 2.4 TB of capacity to fuel server efficiency even in the most data-intensive environments

All new intelligent self-healing feature called Adaptive FlashBack provides complete chip level fault tolerance, which enables ioMemory to repair itself after a single chip or a multi chip failure without interrupting business continuity

System level integration with the latest Fusion-io VSL 3.0 software subsystem

More work per unit of processing with the cut-through Fusion-io architecture, which continues to deliver performance increases as CPUs become more powerful

Extended support for all major operating systems, including Windows, Linux, OSX, Solaris x86, ESXi 5.0 and HP-UX

Field programmability, allowing IT professionals maximum flexibility in customizing their ioMemory platform to meet the unique needs of their enterprise

In a recent white paper sponsored by Fusion-io, analyst firm IDC looks at how Fusion-io technology can help to overcome the inefficiencies of traditional datacenter infrastructures. By solving the performance problems caused by traditional disk-based storage, the IDC paper, titled "Datacenter of the Future," reported that Fusion-io products can help to address today's highly virtualized datacenter environments by delivering higher data performance, reduced operational and capital expenses, and lower power consumption.

�A new approach is necessary to address the growing problem of datacenter inefficiencies,� said Benjamin S. Woo, Program Vice President, Storage & Big Data, IDC. �The I/O subsystem in use today was developed over 30 years ago and is no longer sufficient to serve the demands of today's growing business. Fusion�s ioMemory is a building block for next-generation datacenters that provides applications fully scalable memory for accelerating throughput and drives higher-performance density and efficiency in application server platforms.�

Pricing and Availability
The Fusion-io MLC ioDrive2 and ioDrive2 Duo will be offered in 365 GB, 785 GB, 1205 GB and 2.4 TB capacities, beginning in late November 2011, followed by SLC products in 400 GB, 600 GB and 1.2 TB capacities, with the first product run already committed to key customers and partners.Pricing for Fusion�s new ioMemory platform starts at a manufacturer�s suggested retail price of $5,950 U.S.

Fusion-io reveals the ioDrive2 and ioDrive2 Duo - More news at DV Hardware

Super Talent reveals USB 3.0 enclosure for 2.5-inch HDDs

Super Talent announced the USB 3.0 Storage POD enclosure:

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced the USB 3.0 Storage POD enclosure, a hard drive enclosure that converts almost any 2.5" HDD into a USB 3.0 external hard disk.

Chances are you already have an external USB drive and its USB 2.0 connector is holding it back. The USB 2.0 bus keeps most drives from performing at their true potential and relegates their usage to simple storage backup. Now you can do something about it. By simply changing the enclosure, you can liberate your existing HDD and see double and even triple the speed - without reformatting.

USB 3.0 was made for external storage. With more available power and bandwidth, USB 3.0 unlocks the true performance of these drives and enables them to perform as fast as they could when hooked directly to the SATA bus.

The installation is simple, requires only two screws and takes less than 5 minutes to complete. Simply insert any 2.5" (9.5mm standard) SATA HDD into the USB 3.0 Storage POD enclosure. A specially designed rubber grommet surrounds your drive, holds it firm and provides peace of mind from shock and vibration concerns. Close the cover, apply two screws and this little project is finished.

With an MSRP of $29, the USB 3.0 Storage POD enclosure is a cost effective way to start taking advantage of your new USB 3.0 port. The USB 3.0 Storage POD Enclosure is in stock and will begin shipping immediately.

Super Talent reveals USB 3.0 enclosure for 2.5-inch HDDs - More news at DV Hardware

Samsung reveals the Galaxy Tab 7.0 Plus tablet

Samsung added the Galaxy Tab 7.0 Plus to its tablet lineup. This new 7-incher features a 1024 x 600 pixel resolution and packs a 1.2GHz dual-core processor. The Galaxy Tab 7.0 Plus is available in 16GB and 32GB variants and runs Android 3.2 "Honeycomb". Other features include a 3MP digicam with 720p video recording, 802.11a/b/g/n WiFi, quad-band GSM/GPRS/EDGE and 3G with 21Mbps HSPA and GPS support. The tablet will ship in late October but pricing is still unknown.

Samsung Electronics Co., Ltd, a leading mobile device provider, today announced the launch of the GALAXY Tab 7.0 Plus. Offering a portable, rich multimedia experience on a 7-inch display, the GALAXY Tab 7.0 Plus packs power and productivity into a chic lightweight design. The GALAXY Tab 7.0 Plus runs Google Android Honeycomb, enabling an easy and intuitive user experience.

"Samsung pioneered the seven-inch tablet market with the launch of the GALAXY Tab, marking an innovation milestone in the mobile industry. Building on the success of the GALAXY Tab, we're now delighted to introduce the GALAXY Tab 7.0 Plus reloaded with enhanced portability, productivity and a richer multimedia experience" said JK Shin, President and Head of Samsung's Mobile Communications Business. He added "GALAXY Tab 7.0 Plus is for those who want to stay productive and in touch with work, friends and content anytime, anywhere."

Enhanced Portability
With 7-inch display, GALAXY Tab 7.0 Plus provides enhanced portability, weighing just 345g and measuring at just 9.96mm thin. Enhanced portability ensures that it fits easily into an inside-jacket pocket or a handbag, making it an ideal device for those who need to stay productive and entertained while on-the-move.

Advanced Productivity
GALAXY Tab 7.0 Plus delivers a smooth and intuitive user experience with powerful performance powered by 1.2GHz dual core processor. Mini Apps allows seamless multitasking by consolidating 7 applications easily accessed from a bottom-side tray on main screen. Users can launch favorite features such as music player or calendar as pop-ups over full screen applications. Not only that, users can design an individualized up-to-the-minute interface through Live Panel.

Web browsing is also enhanced by Adobe Flash and super-fast HSPA＋ connectivity, providing download speeds up to three times faster than a conventional HSPA connection. On top of that Wi-Fi Channel Bonding bonds two channels into one for improved network connection and data transfer at up to twice the speed.

Furthermore, the GALAXY Tab 7.0 Plus offers voice and video call support, with no need for a headset. Users can see friends and family from anywhere in the world in high quality thanks to the device's larger screen.

Rich Multimedia on-the-move
Full HD videos can be enjoyed on the 7-inch WSVGA PLS display, with DivX & multi codec support ensuring the device is capable of supporting a variety of different formats. An improved virtual clipboard, which stores text and images enabling easy copy and paste, further adds to these capabilities.

Additionally, the GALAXY Tab 7.0 Plus features Social Hub, Readers Hub and Music Hub services. Social Hub aggregates the user's contacts, calendar and email along with instant messaging and social networking connections all within one easy-to-use interface. Readers Hub provides e-reading content such as e-books, newspapers and magazines. Music Hub enables access to over 13 million songs even when out and about.

GALAXY Tab 7.0 Plus will be available starting in Indonesia and Austria from end-October and gradually rolled to globally including Southeast and Southwest Asia, US, Europe, CIS, Latin America, Middle East, Africa, Japan and China.

Samsung reveals the Galaxy Tab 7.0 Plus tablet - More news at DV Hardware

Amazon reveals a $79 Kindle

Amazon makes eReaders cheaper than ever with the introduction of a $79 ad-supported Kindle. This new edition weighs 170g and is 18 percent smaller than the third-gen Kindle, but there's no touchscreen nor a keyboard. Additionally, the low price is only for the ad-supported version, if you want no ads you'll have to pay $109 for your Kindle.

The previous-generation Kindle has been rebranded to Kindle Keyboard, the WiFi-only version with Special Offers now starts at $99 ($139 without ads) while the 3G edition costs $139 ($189 without ads).

The new latest generation Kindle is for readers who want the lightest, most compact Kindle at an incredible price. The latest generation Kindle features a new design that is 30 percent lighter at just 5.98 ounces, 18 percent smaller, and turns pages 10 percent faster. Kindle is now small and light enough to fit easily in your pocket and carry with you everywhere, yet it still features the same 6-inch, most advanced electronic ink display that reads like real paper, even in bright sunlight.

The new latest generation Kindle is only $79. Kindle is available starting today at www.amazon.com/kindle.

Amazon reveals a $79 Kindle - More news at DV Hardware

Zotac reveals PCI and PCIe X1 editions of GeForce GT 520

Zotac introduced two new GeForce GT 520 graphics cards; one with the old PCI interface and also one with PCI Express x1.

ZOTAC� International, a leading innovator and channel manufacturer, today expands the value GeForce� GT 520 lineup with new PCI and PCI Express x1 form factors for users with pre-built systems that have limited expansion capabilities. The new ZOTAC� GeForce� GT 520 PCI and PCI Express x1 graphics cards breathe new life into older systems by delivering a performance punch and new video capabilities.

�Upgrading your graphics card is the easiest way to boost your system performance and gain new capabilities. The new ZOTAC� GeForce� GT 520 PCI and PCI Express x1 graphics cards shows that you can experience good graphics without upgrading the rest of your system,� said Carsten Berger, marketing director, ZOTAC International.

The ZOTAC� GeForce� GT 520 PCI and PCI Express x1 graphics cards provide DVI, HDMI and VGA outputs with dual simultaneous independent display support for an instant dual-monitor upgrade. The low-profile form factor enables the ZOTAC� GeForce� GT 520 PCI and PCI express x1 graphics card to easily fit in compact pre-built systems with height limitations in addition to expansion limitations.

It�s time to play with the ZOTAC� GeForce� GT 520 PCI and PCI Express x1 graphics card.

General details
New ZOTAC� GeForce� GT 520 PCI and PCI Express x1 graphics cards

NVIDIA� GeForce� GT 520 GPU

Engine clock: 810 MHz

48 unified shaders

Shader clock: 1620 MHz

512MB DDR3 memory

Memory clock: 1333 MHz

64-bit memory interface

DVI, HDMI & VGA outputs

DirectX� 11 technology & Shader Model 5.0

OpenGL� 4.1 compatible

NVIDIA� CUDA� technology

Full HD video playback

Zotac reveals PCI and PCIe X1 editions of GeForce GT 520 - More news at DV Hardware

ASUS reveals three Z68 mainboards with PCI Express 3.0

TPU reports ASUS has introduced three new Intel Z68 based motherboards with PCI Express 3.0 x16 slots.

ASUS unveiled a trio of socket LGA1155 motherboards based on the Intel Z68 chipset, which feature PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated). The new motherboards are PCI-Express Gen 3.0 specifications compliant, complete with switches and electrical components. Leading the pack is the P8Z68 DELUXE/Gen3 in the $250-segement, followed by the P8Z68-V PRO/Gen3 in the $200-segment, and the P8Z68-V/Gen3 in the sub-$200 segment.

All three feature 16-phase Digi+ CPU VRM, an Intel-made gigabit Ethernet controller, and Lucid Virtu support. All three feature the same expansion slot loadout, with two PCI-Express 3.0 x16 (x16/NC or x8/x8), one PCI-Express 2.0 x16 (electrical 2.0 x4), and two each of PCI-Express 2.0 x1 and legacy PCI wired to an ASMedia-made bridge chip.

ASUS reveals three Z68 mainboards with PCI Express 3.0 - More news at DV Hardware