Samsung creates first 30-nm class LPDDR3

Samsung announced the creation of world's first LPDDR3 using a 30nm-class process technology. The company claims this is the most advanced green mobile memory solution.

Samsung Electronics Co., Ltd, a global leader in advanced semiconductor technology solutions, announced today that it has developed the industry�s first monolithic four gigabit (Gb) LPDDR3 (low power double-data-rate 3) memory using 30 nanometer (nm) class* technology for mobile applications such as smartphones and tablet PCs, at the eighth annual Samsung Mobile Solutions Forum held at the Westin Taipei. LPDDR3 DRAM is needed to support faster processors, high resolution displays and 3D graphics in high-end next generation mobile devices

�Samsung is offering the most advanced green mobile memory solution by developing the industry�s first 30nm-class 4Gb-based LPDDR3 packages,� said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, Samsung Electronics. �Samsung will keep working closely with mobile device designers to deliver high-performance mobile solutions, while expanding the next-generation mobile memory market.�

The new 4Gb LPDDR3 DRAM can transfer data at up to 1,600 megabits per second (Mbps), which is approximately 1.5 times faster than the industry�s current highest performance LPDDR2, which operates at 1,066Mbps. The new component also consumes 20 percent less electrical power than its predecessor.

In addition, by stacking two 4Gb chips, Samsung is enabling use of a single 1GB LPDDR3 package, with a data transmission rate up to 12.8 gigabytes (GB) per second.

Starting next quarter, Samsung will begin sampling the 4Gb-based LPDDR3 chips to key mobile device providers. The chips are expected to be widely adopted next year in advanced mobile applications including next-generation smartphones and tablet PCs.

To accommodate the growing need for higher density mobile memory solutions to process large amount of data, the maximum amount of mobile DRAM in high-end mobile devices will grow from 1GB (8Gb) up to 2GB (16Gb) by early next year. These densities will be available by stacking four 4Gb LPDDR3 chips.

According to a research report from IHS iSuppli, the market for LPDDR3 DRAM will expand sharply starting in 2013. Samsung will be readying the market by mass producing more components in 2012 therein encouraging faster adoption of premium mobile DRAM solutions throughout the mobile electronics industry.

Samsung creates first 30-nm class LPDDR3 - More news at DV Hardware

Nox Xtreme Hummer 3.0 full-tower case revealed

TC Mag reports Nox Xtreme introduced the Hummer 3.0, a new full-tower steel case that supports micro ATX, ATX, E-ATX, XL-ATX and Flex-ATX motherboards. It measures 610mm x 232mm x 520mm (H x W x D) and is sold in Europe for around 109.90.

Nox's PC case comes with an all-black coating, a top-plated I/O panel with USB 3.0 (x 2), USB 2.0 (x 2) and eSATA (x 2) ports, a built-in, 2-channel fan controller, six 5.25-inch bays, six internal 3.5/2.5-inch bays, four pre-drilled holes for watercooling tubing (all are at the back), and is equipped with four fans - one 230mm model with white LEDs in front, plus two 140mm spinners on top, and another 140mm fan at the rear.

Nox Xtreme Hummer 3.0 full-tower case revealed - More news at DV Hardware

Alpenf�hn K2 processor cooler now available

Alpenf�hn's K2 is now available in Europe for 74.90EUR. This cooler weighs a whopping 1050g, it offers a nickel-plated copper base, eight nickel-plated copper heatpipes and two aluminium heatsinks that are cooled by up to three 120/140mm fans. Included with the cooler is a 120mm fan as well as a 140mm fan. The K2 is compatible with all contemporary desktop platforms from Intel and AMD.

Alpenf�hn is aiming at the performance crown under the CPU coolers with the K2. For this, Alpenf�hn is employing two cooling towers and ships the unit with two, potent Wing Boost fans. The middle fan with 140 mm is intended to keep the air flow at a maximum, while the smaller 120 mm unit in front is meant to offer maximal compatibility to modern mainboards, while still providing impressive air flow. Those wanting to go even further may install a third fan in the rear of the cooler. The Alpenf�hn K2 CPU cooler is available immediately at Caseking.

The cooler utilizes an incredible amount of materials with a massive weight of 1050 grams. Using more mass does not simply equate to greater performance, as only an intelligent use of such will make for a great cooler and this is something the Alpenf�hn engineers are certainly experts in. Eight heatpipes are embedded in a Copper, with both aspects featuring a high-quality Nickel plating. On top of that, all contact points between cooling fins, heatpipes and ground plate feature high-quality solder points to maximize the potential of the K2.

To dissipate the heat from the CPU, the fine and numerous Aluminum fins offer an incredibly large surface area and the ability to install up to three fans. Alpenf�hn ships the K2 with a 120 and larger 140 mm of the award winning Wing Boost cooling fans, which offer maximal air pressure in combination with an incredibly quiet operating noise. These fans feature a unique blade design and rubberized surface, virtually eliminating vibration at the source. While the Wing Boost series is available in black/blue and black/orange variants, Alpenf�hn is currently only shipping the black/white version with exclusively with the K2 cooler.

Both fans utilize PWM functionality, allowing for flexible adjustment of the rotation speed. As most mainboards only offer a single PWM connector for the CPU cooler, the included splitter enables to proper monitoring of both fans with a single such plug. At the slowest setting the 120 mm fan produces inaudible 8 dB(A) noise levels, while the 140 mm variant is just as quiet with 10 dB(A). But even at full throttle both manage to impress with an extremely quiet 25 dB(A) rating, while pushing 104m�/h and 108m�/h of air respectively.

On top of that, the Alpenf�hn K2 implements a modern fin design, which is not only great to look at. but also results in a clean air flow, further reducing the overall noise level. Besides the pair of fans, mounting systems for all modern sockets from AMD (AM2, AM2+, AM3, AM3+, FM1) and Intel (775, 1155, 1156, 1366) along with a backplate for a proper and worry-free installation, ship with the massive cooler.

The Alpenf�hn K2 CPU Cooler - 120/140mm is available immediately for a price of 74.90 Euro at www.caseking.de.

Alpenf�hn K2 processor cooler now available - More news at DV Hardware

Real World Labs And Enermax Joint Contest

Real World Labs and Enermax are having a contest, you can check it out over here.

With the latest ETS-T40 CPU Cooler line by Enermax taking the market by storm with both their excellent performance and great looks we decided to join up with our friends over at Enermax and give 3 lucky readers the chance to walk away with one of these babies.

Real World Labs And Enermax Joint Contest - More news at DV Hardware

Aluminium chassis for ultrabooks likely to be in short-supply in 2012

DigiTimes heard aluminium alloy enclosures for ultrabooks will likely be in shortage next year:

The supply of aluminum alloy chassis for ultrabooks may fall short of demand in 2012 as most ultrabook models launched by brand vendors will come with the metal chassis. Capacities at metal chassis makers including Catcher Technology and Foxconn Technology have been fully booked to the end of 2011, according to industry sources.

The ultrabook models already announced including Acer's Aspire S3, Lenovo's IdeaPad U300s, Toshiba's Portege Z830 and Asustek's forthcoming UX-series lineup, all will be available with metal chassis, the sources noted.

Aluminium chassis for ultrabooks likely to be in short-supply in 2012 - More news at DV Hardware

Samsung reveals the Galaxy Tab 7.0 Plus tablet

Samsung added the Galaxy Tab 7.0 Plus to its tablet lineup. This new 7-incher features a 1024 x 600 pixel resolution and packs a 1.2GHz dual-core processor. The Galaxy Tab 7.0 Plus is available in 16GB and 32GB variants and runs Android 3.2 "Honeycomb". Other features include a 3MP digicam with 720p video recording, 802.11a/b/g/n WiFi, quad-band GSM/GPRS/EDGE and 3G with 21Mbps HSPA and GPS support. The tablet will ship in late October but pricing is still unknown.

Samsung Electronics Co., Ltd, a leading mobile device provider, today announced the launch of the GALAXY Tab 7.0 Plus. Offering a portable, rich multimedia experience on a 7-inch display, the GALAXY Tab 7.0 Plus packs power and productivity into a chic lightweight design. The GALAXY Tab 7.0 Plus runs Google Android Honeycomb, enabling an easy and intuitive user experience.

"Samsung pioneered the seven-inch tablet market with the launch of the GALAXY Tab, marking an innovation milestone in the mobile industry. Building on the success of the GALAXY Tab, we're now delighted to introduce the GALAXY Tab 7.0 Plus reloaded with enhanced portability, productivity and a richer multimedia experience" said JK Shin, President and Head of Samsung's Mobile Communications Business. He added "GALAXY Tab 7.0 Plus is for those who want to stay productive and in touch with work, friends and content anytime, anywhere."

Enhanced Portability
With 7-inch display, GALAXY Tab 7.0 Plus provides enhanced portability, weighing just 345g and measuring at just 9.96mm thin. Enhanced portability ensures that it fits easily into an inside-jacket pocket or a handbag, making it an ideal device for those who need to stay productive and entertained while on-the-move.

Advanced Productivity
GALAXY Tab 7.0 Plus delivers a smooth and intuitive user experience with powerful performance powered by 1.2GHz dual core processor. Mini Apps allows seamless multitasking by consolidating 7 applications easily accessed from a bottom-side tray on main screen. Users can launch favorite features such as music player or calendar as pop-ups over full screen applications. Not only that, users can design an individualized up-to-the-minute interface through Live Panel.

Web browsing is also enhanced by Adobe Flash and super-fast HSPA＋ connectivity, providing download speeds up to three times faster than a conventional HSPA connection. On top of that Wi-Fi Channel Bonding bonds two channels into one for improved network connection and data transfer at up to twice the speed.

Furthermore, the GALAXY Tab 7.0 Plus offers voice and video call support, with no need for a headset. Users can see friends and family from anywhere in the world in high quality thanks to the device's larger screen.

Rich Multimedia on-the-move
Full HD videos can be enjoyed on the 7-inch WSVGA PLS display, with DivX & multi codec support ensuring the device is capable of supporting a variety of different formats. An improved virtual clipboard, which stores text and images enabling easy copy and paste, further adds to these capabilities.

Additionally, the GALAXY Tab 7.0 Plus features Social Hub, Readers Hub and Music Hub services. Social Hub aggregates the user's contacts, calendar and email along with instant messaging and social networking connections all within one easy-to-use interface. Readers Hub provides e-reading content such as e-books, newspapers and magazines. Music Hub enables access to over 13 million songs even when out and about.

GALAXY Tab 7.0 Plus will be available starting in Indonesia and Austria from end-October and gradually rolled to globally including Southeast and Southwest Asia, US, Europe, CIS, Latin America, Middle East, Africa, Japan and China.

Samsung reveals the Galaxy Tab 7.0 Plus tablet - More news at DV Hardware

Apple closes in on own GPU design

Once upon a time, Apple was in the habit of developing an armada of hardware itself. Jobs and Co loved the idea of being full-blown designers where each and every component could be unique, stylised and better than everyone else�s bits. Apple�s drive to mass market status saw that strategy dumped. KitGuru ponders whether the future will look a lot like the past.

Read more at KitGuru.

Apple closes in on own GPU design - More news at DV Hardware