European nanoelectronics research institute IMEC sees 2015 as about the time when the first extreme ultra-violet lithography system able to run 450-mm diameter wafers will be available and hence as the time it will need to have a dedicated 450-mm wafer clean room available.
Luc van den Hove, president and CEO of IMEC laid out a timeline to a press gathering here. It began in 2012 with 450-mm wafer tool and metrology testing, moving on to 450-mm process development between about 2013 and 2016 and then into advanced production starting in about 2016.
IMEC foresees 450mm wafer availability in 2015 - More news at DV Hardware
