NVIDIA: Qualcomm Snapdragon S4 Pro performance claims are wrong

The Inquirer reports NVIDIA attacked Qualcomm over claims that the dual-core Snapdragon S4 Pro beats NVIDIA's quad-core Tegra 3 SoC. Seems like the start of a good old fashioned mud fight, this time not in the discrete graphics card market but in the mobile chip market.

Yesterday Qualcomm's Rob Chandok, SVP of Software Strategy and president of the firm's Innovation Center told journalists at a roundtable that its Snapdragon S4 MSM8960 system-on-chip (SoC) and its newly announced dual-core Snapdragon S4 Pro beat Nvidia's five-core Tegra 3 chip in just about every benchmark under the sun. Now Nvidia has fired back, saying that the figures bandied about by Qualcomm are incorrect based on reviews on the web.

Chandok did not mention Nvidia's Tegra 3 by name in his presentation, instead using phrases such as "quad-core 1.3-1.4GHz chip", which anyone with access to a search engine can work out is a reference to Nvidia's Tegra 3 chip. Nvidia clearly thought Chandok's comments were aimed at its burgeoning Tegra 3 chip and fired back claiming the results simply do not correlate with independent reviews.

Full details over here.

NVIDIA: Qualcomm Snapdragon S4 Pro performance claims are wrong - More news at DV Hardware

Qualcomm: Microsoft providing Snapdragon-based test PCs to developers

Qualcomm sends out word that Microsoft is providing developers with Snapdragon-based Windows on ARM test systems.

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its Snapdragon� processor will be joining Microsoft Corp.'s Windows on ARM developer seeding program. Qualcomm is working with Microsoft to provide test PCs to select developers in order to test and optimize apps for forthcoming Snapdragon-powered Windows on ARM PCs and tablets. This invitation-only program will combine a pre-release version of Windows on ARM with next-generation, high performance Snapdragon S4 test PCs. These test PCs are not representative of commercial form factors or the final Windows on ARM experience; they are designed to give developers early access to building and testing Windows Metro style apps on Qualcomm's latest technology.

The Windows on ARM developer seeding program will help ensure that Windows Metro style apps available in the Windows Store work great on all Windows 8-based PCs, including those with Qualcomm's ARM-compliant Snapdragon processors.

"Microsoft's development tools and the Qualcomm Snapdragon test PCs will enable developers to build and test Metro style apps for Windows on ARM PCs," said Stefan Kinnestrand, director of business planning, Windows Division, Microsoft. "Based on Qualcomm's Snapdragon processor, these systems will equip developers to create Metro style apps and offer a rich set of hardware peripherals that plug in and help enable seamless user experiences on the Windows on ARM platform."

Qualcomm, with Microsoft, is among those leading the shift to anytime, anywhere connectivity. The Snapdragon mobile processor will offer a combination of processing performance, rich multimedia, GPS, high-performance graphics, wireless connectivity and power efficiency with Windows on ARM.

"Qualcomm is committed to the Windows on ARM ecosystem and knows that enabling developers is a crucial factor for its success," said Luis Pineda, senior vice president of product management, computing and consumer products at Qualcomm. "We are now providing Snapdragon S4 test PCs with built-in 4G LTE, activated in some regions, to software application developers."

Qualcomm's participation in the Windows on ARM developer seeding program provides select developers with the latest generation Snapdragon S4 test PCs running a pre-release version of Windows on ARM. These test PCs contain Qualcomm's Snapdragon S4 MSM8960 processor with second-generation high performance, power efficient CPU, hardware accelerated Adreno� graphics, full multimedia, GPS, sensors, and peripherals that will enable development and test of next-generation Windows Metro style apps for the coming wave of Windows on ARM PCs.

Earlier today NVIDIA informed the press that Microsoft is handing out Tegra 3 based test PCs to developers.

Qualcomm: Microsoft providing Snapdragon-based test PCs to developers - More news at DV Hardware

Koolance CPU-370S series waterblock released for Intel and AMD

TPU noticed Koolance has finished two new waterblocks; the CPU-370SA for AMD processors and the CPU-370SI for Intel CPUs. The blocks are available on the company's website for $59.99 and $64.99, respectively.

Both models are lower priced versions of the CPU-370 block and feature a nickel-plated copper microfin cold plate (0.25 mm fins, 0.30 mm channels), an o-ring sealed impingement plate, a solid acetal top, and standard G 1/4 BSP threading.

Koolance CPU-370S series waterblock released for Intel and AMD - More news at DV Hardware

ThermalTake preannounces CeBIT 2012 lineup

ThermalTake send out word about the new products it will showcase at CeBIT 2012, you can find more details at the company's CeBIT event page.

Visitors to the Thermaltake stand (Hall 17, E60) at the CeBIT 2012 from 6 to 10 March 2012 in Hannover Germany will witness the first heartbeat of a new compact generation of the gaming mouse - Level 10 M Mouse, which is the collaboration between Thermaltake Group and BMW Group subsidiary DesignworksUSA continues from the previous success LEVEL 10 chassis in 2009.

Being the industry pioneer brand in PC DIY solutions, professional gaming products and unique and functional Apple accessories, Thermaltake Group with its three subsidiary brands - Thermaltake, Tt eSPORTS and LUXA2 will be presenting a visionary outlook on future technical developments and the latest and most exciting products for the year 2012 at the one of the biggest and the most international event in the digital industry!

Further information about Thermaltake Technology at CeBIT 2012 is available online: http://globalevent.thermaltake.com/cEBIT2012/

The Level 10 M Mouse
Design Collaboration by Thermaltake and BMW Group DesignworksUSA

Since 2009, Thermaltake ventured into a completely new PC chassis with the revolutionary concept of the Level 10 high-end gaming tower chassis. Now Thermaltake will once again present a masterpiece that might have come from another planet: the Level 10 M Mouse will be celebrating its premiere at the CeBIT2012 !

In 2009 Thermaltake, the leader and innovator of pro-gaming computer chassis, for the first time partnered with the wholly owned BMW Group subsidiary. The studio had been tasked with the design concept of the Level 10 high end gaming tower. The result was a chassis which triggered off a lot of praise from the IT and pro-gaming world and many awards for its sheer revolutionary approach to computer housing. Now the collaboration continues with the expansion of the Level 10 experience to a range of gaming peripherals for Thermaltake�s e-sports division - Tt eSPORTS.

"It is no exaggeration to say that world is going to witness the pre-invention of the gaming mouse. The purist design of the Level 10 M Mouse, that BMW Group DesignworksUSA designs concept for a news series of innovative gaming peripherals for Thermaltake. This centrepiece dazzles with its passionate eSports and reinterprets the breathtaking aesthetic design of the Thermaltake Level 10 chassis. With the Level 10 M Mouse, we are demonstrating once again that pioneering spirit is an integral part of the Thermaltake brands DNA. Thermaltake Group is right at the forefront of this surge in innovation, we feel a very particular obligation for its future!" said Mr. Kenny Lin, Chairman and CEO of the Thermaltake Group.

Glance over the exhibits at CeBIT 2012 :

Thermaltake
Thermaltake prepared to amplify enthusiasts' game time by showcasing a succession of gaming's amity from Level 10 GT Battle chassis, ARMOR REVO chassis, Level 10 GTS chassis, BigTyp Revo downfacing air cooler, Water2.0 Liquid Cooling Series, Frio Extreme cooler, Toughpower Grand Platinum Snow PSU, Toughpower XT 1275W Platinum Snow PSU, SMART Series PSU to other new cases, coolers, power supply units and accessories.

Motivate by eSports culture as well as setting the PC gaming hardware trend, Thermaltake will reveal the new battle version of Level 10 GT, the revolutionary gaming chassis ARMOR REVO and the Level 10 GTS mid-tower of pedigree, grant user a much closer gaming experience while being on their games. Further, being the specialist and the market leader in thermal solution, at CeBIT 2012 Thermaltake want to facilitate a smoother gaming experience for users, will introduce the new Hover top-down air cooler, Water 2.0 all-in-one Liquid Cooling Series, Frio Extreme supreme cooler of Frio Series, the new Toughpower Grand Series Snow Platinum power supply unit which has both "Red Dot Award" and "iF product design award" titles in place and the world's first high-end all white Toughpower XT 1275W Snow Edition power supply unit with the blessing of 80Plus Platinum. Last but not the least, SMART Series with further prospect to secure the system with the appropriate wattage.

Tt eSPORTS
Tt eSPORTS is always creatively promoting gaming products that differentiate from others, with strong motivation in fulfilling the mission of delivering the best gaming experience to the world. In CeBIT 2012, Tt eSPORTS is also preparing to launch a whole new series of gaming keyboards and mice, as well as the highlight of the year: BMW DesignworksUSA's collaboration on Level 10 M Gaming Mouse project. It is a continuation of Level 10 design concept and an extension in gaming peripherals.

The successful year of Tt eSPORTS in 2011 is now prepared to launch a series of new product line - Tt eSPORTS Chao - in 2012, with DRACCO headsets recently revealed at Taipei Game Show 2012 and attracted not only gamers' attention but also media's inquiry about DRACCO's design concept and the motivation behind this DRACCO project. Further, the COMBAT WHITE series of gaming keyboards and mice are also recently announced, with already strong support from Tt eSPORTS fans on MEKA series keyboards and BLACK mouse, the white-color version seem attract more attention who appreciate a slight different color appearance on their gaming gadgets. The year 2012 is also a milestone for Tt eSPORTS as we officially present SAPHIRA and THERON gaming mice, endorsed by the worldwide famous StarCraft2 players - Aleksey "White-Ra" Krupnyk, and Tt APOLLOS's StarCraft2 player - SoftBall. And of course, both will be displayed and introduced at CeBIT 2012 to demonstrate that Tt eSPORTS shares the same passion and value with all players around the world, by taking care of the customers' needs with cutting-edge technology, and with eSports gaming characteristic design.

LUXA2
LUXA2, premier designer and manufacturer of unique and functional Apple accessories including holders and cases, this year is proud to be launching its first ever Bluetooth product- the Bluetooth Headphones BT-X3. This headphone is perfect to be used with iPod, iPhone, Android phones and other smart mobile devices.

While the business focus is Apple product accessories, starting 2012, LUXA2 will also offer accessories for other smart phones and provide top-of-the-line products and services to owners of Droids, HTC, Samsung...etc.

Also, LUXA2 will present its newest accessory lineup at CeBIT 2012 including brand new protective cases and sleeves for iPhone 4S, iPad 2 and Macbook. Brand new iPhone 4S cases include the slim and lightweight solid color �Lille Case for iPhone 4S' and the more fun and nature inspired �Modica Case for iPhone 4S'. Both cases are very slim and light weight, they sure will add extra personality to your mobile phones! LUXA2's goal is to become the go-to resource for any individual living a mobile lifestyle.

Thermaltake‧Tt eSPORTS‧LUXA2 -The professional and enthusiastic team
Thermaltake Group is on the mission to broaden the lifestyle, gaming culture and fashion technology by creating fascinate innovations. In the year 2012, Thermaltake, Tt eSPORTS and LUXA2 will keep taking care of the customers' needs with cutting-edge technology and amazing products!

ThermalTake preannounces CeBIT 2012 lineup - More news at DV Hardware

Howto test Windows 8 as a virtual machine

Microsoft has just released the public beta version of Windows 8, so just like many other tech enthusiasts you may be excited to test the new features of the software giant's latest operating system. You could install the operating system on a secondary PC or set up a dual-boot environment on your primary rig, but considering this is 2012 there's an easier, more attractive alternative.

TechSpot explains how you can test the Windows 8 Consumer Preview as a virtual machine, you can read the guide over here.

With the launch of Windows 8's Consumer Preview, you're probably itching to spend some quality time with Microsoft's latest operating system. Although you may have already downloaded the ISO, we bet some of you haven't decided how you're going to install it.

Fortunately, running Windows 8 in a virtual machine solves all that: it won't remove your current OS, you can access it anytime you want without rebooting and it doesn't require any extra hardware. What's more, the test OS can be deleted in only a few mouse clicks.

Howto test Windows 8 as a virtual machine - More news at DV Hardware

ADATA delivers 1600MHz DDR3 CL9 8GB modules

ADATA presents new 1600MHz DDR3 modules with CL9 timings and a capacity of 8GB:

ADATA� Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, once again achieves a breakthrough in overclocking memory specifications with the launch of single 8GB 1600MHz CL9 and dual kit 16GB memory modules. As a market solution for 1600MHz 8GB low latency overclocking, the new modules support the latest quad-channel X79 platform, and meet the demands of enthusiasts for high density memory.

ADATA�s Product Planning Department DRAM Project Manager Alex Wu said: "In recent years, gamers and overclockers care about more than just the pursuit of extreme performance. Energy consumption has become a major consideration when purchasing electronics.� He added: "The new XPG Gaming V 2.0 1600G 8GB single and 16GB dual kit memory modules use voltage of only 1.35V, with 9-11-9-27 timing, and are compatible with the latest X79 four-channel platform. They provide gamers with the opportunity to significantly upgrade their RAM all the way to 64GB, in order to experience faster operation and performance of desktop computers."

In addition to high density, low-latency, low-voltage, and innovative heat conduction cooling technology, these modules are equipped with a unique heat sink and the industry's first high quality double copper 8-layer circuit board, which improves memory cooling and lowers power consumption. In addition, each chip is selected from original manufacturer 4Gb memory chips, and put through a rigorous screening and testing program to ensure the greatest degree of stability and durability, for more peace of mind for consumers.

ADATA Series memory modules come with a lifetime warranty1, providing the best protection and peace of mind.

ADATA delivers 1600MHz DDR3 CL9 8GB modules - More news at DV Hardware

RAIDMAX delivers RX-600AF 600W PSU

RAIDMAX introduces a new 600W 80Plus Bronze power supply; the RX-600AF. The unit has a MSRP of $59.99, it has two +12V rails with 22A each and is cooled by a large fan.

RAIDMAX, a computer chassis provider, is pleased to announce their new 600W Power Supply � RX-600AF. The RX-600AF provides reliable power to your PC while reducing electricity loss through its high efficiency design.

Energy Efficient
With certified 80 Plus Bronze efficiency, the RAIDMAX RX-600AF converts up to 85% of the input electricity into usable energy. This translates to less electrical usage and lower energy cost.

Effective Cooling
The powerful fan keeps the RX-600AF at optimal operating temperatures at regular usage. At times when you want to push your PC harder, the turbo fan controller gives the RX-600AF extra cooling ability anytime.

High-Performance Connections
RAIDMAX's newest power supply comes with numerous high quality connectors for secure connections to your hardware.

Classic Design
With its white finish and elegant white fan, the RX-600AF's simple aesthetic design is not such much eye-catching as it is eye-pleasing.

Protections
Including several safety precautions such as Short Circuit Protection (SCP), Over Voltage Protection (OVP), and Over Power Protection (OPP), the RAIDMAX RX-600AF ensures all your hardware is well powered while protecting them from power abnormalities.

Power Supply Connectors:

M/B 20+4 pin x1

CPU 4+4 pin x1

PCI-E 6+2 pin x2

SATA x6

MOLEX 4 pin x4

Floppy x1

RAIDMAX delivers RX-600AF 600W PSU - More news at DV Hardware